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ELECTRONICS

Potting & Encapsulation.

Metering, mixing and dispensing two-component materials to encapsulate electronic components, modules, connectors and industrial assemblies for environmental protection, electrical insulation and mechanical support.

ALSO RUNSPlus epoxy potting compounds, polyurethane encapsulants and silicone encapsulants.
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Nozzle potting a tray of circuit assemblies held in cups on a production fixture

Requirements.

  • Accurate mix ratio.
  • Precise and repeatable dispense volume.
  • Continuous and shot-based dispensing capability.
  • Handle large differences in component viscosity.
  • Controlled flow for complete cavity filling.
  • Minimize entrapped air.
  • Consistent part-to-part results.
  • Support manual, semi-automated and robotic production.
  • Accommodate different part sizes and production rates.

Fluidic solution.

  • PK1D for fixed-ratio applications.
  • PK2D for variable-ratio and difficult material combinations.
  • Servo-controlled positive-displacement metering for accurate ratio, flow and shot size.
  • Continuous-flow capability for larger-volume potting.
  • Programmable dispensing for multiple part sizes and recipes.
  • Integration with XYZ tables, conveyors or robotic automation.
RECOMMENDED SYSTEMBuilt on PK1D · PK2D.
PK1D PK2D

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